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SINTAIKE STK-7200R全自動晶圓切割貼膜機（滾輪）特點：
全自動晶圓/框架裝卸
日本進口晶圓搬運機械手臂，晶圓對位系統
全自動晶圓貼膜
標置ESD特氟龍電鍍接觸晶片夾盤
應對DBG工藝：貼膜后再撕BG膜
貼膜動作：自動拉膜和貼膜
晶圓臺盤：通用(一體式)特氟龍防靜電涂層接觸式臺盤；或硅膠臺盤，或陶瓷臺盤

全自動晶圓切割貼膜機（滾輪）STK-7200R規格：
Wafer Size 6” 、8” , Thickness:100 ~ 725 um
Frame Size DISCO 6”, 8”
Tape Type Blue Tape or UV Tape
　 Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm
Wafer Place Accuracy X-Y: /- 0. 2 mm Θ: /- 0.5°
Input & Output Two Wafer Cassette Input / Two Frame Cassette Output
ESD Control ESD Roller / ESD Wafer Chuck / ESD Ion Blower
Cutting System Adjustable Ring Cutter
Control Unit PC with 17” Touch Panel Display
Power Supplier Single Phase AC 220 V, 25A
Air Supplier 5.0 Kgf/cm2 CDA, 150 L/min
Dimensions 1750 mm (W) × 1350 mm (D) × 1800 mm (H)
　 (Include Load port, exclude tower light)
Net Weight 650 Kg

STK-7200R全自動晶圓切割貼膜機性能：
Wafer Yield >= 99.9 (not include damage wafers)
Mounting Quality No Air Bubble (not include particle bubble)
UPH >= 65 PCs Wafers
MTBF > 500 Hours
MTTR < 1 Hour
Down Time < 3
Conversion Time <= 20 Minutes (include change tape)